Sapphire and LED

LED sapphire refers to a substrate sheet for the processing of synthetic sapphire

( single crystal alumina ) . Synthetic sapphire ( single crystal alumina ) may be used in decorative applications ( such as jewelry , sheet glass , etc. ) , industrial materials and the semiconductor substrate such as windows , dedicated to the LED sapphire substrates require special orientation and low dislocation density, etc. Therefore, synthetic sapphire belongs to the high-end products.

LED sapphire

The first low fabricating a gallium nitride liner (GaN) -based epitaxial wafer , this process mainly in the metal organic chemical vapor deposition epitaxy furnace complete. Ready to produce GaN-based epitaxial wafer and a variety of source materials required purity of the gases , follow the step by step process requirements of the wafer can be done. The substrates used are sapphire, silicon carbide and silicon substrate , as well as GaAs, AlN, ZnO and other materials. MOCVD is the use of gaseous reactants ( precursors ) and the organometallic group Ⅲ and Ⅴ family reaction of NH3 on the surface of the substrate , the desired product is deposited on the substrate surface. By controlling the temperature, pressure, reactant concentrations and type of scale , thereby controlling the coating composition , the crystal quality of the same . MOCVD epitaxial furnace production of LED epitaxial wafers is the most commonly used devices. Next is a LED PN junction of the two electrodes for processing , the electrode processing is the key process of production of LED chips , including washing , evaporation , yellow, chemical etching , fusing , grinding ; then dicing the LED MAO , tested and sorting , you can get the desired LED chips. If the wafer cleaning is not clean enough , evaporation system is not normal , it will lead to deposition of the metal layer ( refer etched electrode ) will fall off, the appearance of discolored metal layer , gold foam and other abnormalities. Deposition process is sometimes required collet fixing chips, it will produce clamp marks ( in addition to visual inspection must pick ) . Yellow operations include baking, the photoresist , photographic exposure, development , etc., if the developer does not have holes in the mask will be full and luminous area residues more metals. Wafer manufacturing process in the preceding paragraph , the system Cheng Ruqing wash , evaporation , yellow, chemical etching , fusing , grinding and other operations must use the forceps and baskets , vehicles and so on, so there will be grain electrode scratching things from happening .

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